Core Technology & Functionality
Our eyelet terminals leverage mirror EDM (Electrical Discharge Machining) to achieve ultra-precise chamfers with Ra ≤0.1μm surface smoothness, eliminating micro-burrs that cause signal degradation. Key innovations:
Sub-Micron Chamfering: 45°±0.5° angled edges ensure seamless wire insertion and 100% gas-tight crimping.
High-Force Retention: Phosphor bronze (C51000) construction withstands 50N axial pull-out force.
Automated Inspection: Vision systems verify dimensional accuracy to ±0.003mm for critical pin zones.
Core Role:
Enables vibration-resistant, low-impedance connections (≤2mΩ) in high-current circuits.
Products details
Eyelet Terminal with Mirror-Finished Contact for Low-Impedance Connection
Our high-precision eyelet terminal series is engineered to ensure ultra-reliable low-impedance connections across high-current electrical systems. Leveraging mirror-finished contact surfaces created by EDM (Electrical Discharge Machining), these terminals eliminate signal loss, mechanical burrs, and resistance spikes that plague conventional stamped terminals.
Mirror-Finished Eyelet Terminal for Critical Electrical Applications
Our eyelet precision terminal technology uses mirror EDM to create sub-micron chamfers at Ra ≤0.1μm, ensuring 100% gas-tight crimps. With 45°±0.5° edge angles, wire insertion becomes seamless, while the C51000 phosphor bronze base offers up to 50N axial retention force. These terminals consistently achieve electrical contact resistance ≤2mΩ — critical for automotive, industrial, and renewable energy applications.
Precision Engineering in Mirror-Finished Contact Terminals
Tungsten carbide tooling guarantees ±0.002mm die accuracy across over one million stamping cycles. Vision inspection systems verify critical contact zones to ±0.003mm, ensuring consistency for every mirror-finished contact delivered. This level of dimensional control is essential in power electronics, ECU interfaces, and solar junctions.
Why Our Eyelet Terminals Deliver Superior Low-Impedance Connection
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Chamfering Excellence: Mirror EDM reduces contact resistance by 30% compared to traditional polishing.
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Mechanical Strength: Phosphor bronze ensures long-term retention and vibration resistance (20G validated).
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Thermal Stability: Performance exceeds USCAR-2 and LV214 under harsh automotive cycling.
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Conductivity Leadership: Custom copper alloy (C19700) offers 85% IACS conductivity.
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Scalable Output: 250,000+ units/day capacity with automated sorting and <50PPM defect rate.
Applications
Automotive E/E Architecture: Battery busbars, ECU grounding terminals, EV charging ports.
Industrial Control Systems: PLC wiring panels, motor terminal blocks, robotic arm connectors.
Renewable Energy: Solar inverter junctions, wind turbine power distribution units.
Consumer Electronics: Power supply units, appliance control boards.
5 Reasons to Choose Us
Chamfering Revolution:
Mirror EDM surpasses mechanical polishing, achieving optical-grade finishes that reduce contact resistance by 30%.
Tooling Mastery:
Tungsten carbide dies maintain ±0.002mm tolerance through 1M+ stamping cycles.
Material Science:
Custom alloy formulations (e.g., C19700 copper) optimize conductivity (85% IACS) and stress relaxation resistance.
Validation Rigor:
Exceeds USCAR-2 and LV214 standards for crimp integrity (20G vibration/thermal cycling tests).
Scalable Precision:
250K units/day output with automated sorting (defect rate <50 PPM).
Explore electrical contact reliability standards via the USCAR-2 Performance Specification
