Core Technology & Functionality
Our eyelet terminals leverage mirror EDM (Electrical Discharge Machining) to achieve ultra-precise chamfers with Ra ≤0.1μm surface smoothness, eliminating micro-burrs that cause signal degradation. Key innovations:
Sub-Micron Chamfering: 45°±0.5° angled edges ensure seamless wire insertion and 100% gas-tight crimping.
High-Force Retention: Phosphor bronze (C51000) construction withstands 50N axial pull-out force.
Automated Inspection: Vision systems verify dimensional accuracy to ±0.003mm for critical pin zones.
Core Role:
Enables vibration-resistant, low-impedance connections (≤2mΩ) in high-current circuits.
Products details
Applications
Automotive E/E Architecture: Battery busbars, ECU grounding terminals, EV charging ports.
Industrial Control Systems: PLC wiring panels, motor terminal blocks, robotic arm connectors.
Renewable Energy: Solar inverter junctions, wind turbine power distribution units.
Consumer Electronics: Power supply units, appliance control boards.
5 Reasons to Choose Us
Chamfering Revolution:
Mirror EDM surpasses mechanical polishing, achieving optical-grade finishes that reduce contact resistance by 30%.
Tooling Mastery:
Tungsten carbide dies maintain ±0.002mm tolerance through 1M+ stamping cycles.
Material Science:
Custom alloy formulations (e.g., C19700 copper) optimize conductivity (85% IACS) and stress relaxation resistance.
Validation Rigor:
Exceeds USCAR-2 and LV214 standards for crimp integrity (20G vibration/thermal cycling tests).
Scalable Precision:
250K units/day output with automated sorting (defect rate <50 PPM).
