Heat Transfer
Verified thermal conductivity of ≥25 W/m·K supports heat transfer through
the ceramic plate toward the pump housing.
Alumina Ceramic Heat Dissipation Plate for EV Water Pumps | ZQ
1.High thermal conductivity
2.High electrical insulation resistance
3.Custom irregular shapes, perfect match with circuit boards
4.High temperature resistance and excellent corrosion resistance
The custom shaped ceramic plate is placed between the aluminum housing and the circuit board in the electric water pump.
Application :
Electric water pump of new energy vehicle
2.High electrical insulation resistance
3.Custom irregular shapes, perfect match with circuit boards
4.High temperature resistance and excellent corrosion resistance
The custom shaped ceramic plate is placed between the aluminum housing and the circuit board in the electric water pump.
Application :
Electric water pump of new energy vehicle
Products details
EV Water Pump Thermal & Electrical Interface
Custom Alumina Ceramic Heat Dissipation Plate for EV Water Pumps
A custom ceramic heat dissipation plate designed for installation
between the EV water pump PCB and aluminum pump housing, combining heat transfer,
electrical insulation and thin-profile ceramic construction.
>96% Alumina
≥25 W/m·K
1014 Ω·cm
0.1–1.0 mm Thickness
Drawing-Based ODM
≥25 W/m·K
1014 Ω·cm
0.1–1.0 mm Thickness
Drawing-Based ODM
Why Use an Alumina Ceramic Plate in an EV Water Pump?
Electronic and EV water pumps integrate compact electrical and mechanical systems
in a limited space. Heat generated by the circuit board must be transferred away
while the PCB remains electrically isolated from the aluminum housing.
In this application, the alumina ceramic plate sits between the PCB and aluminum
pump housing. Its role is to support heat transfer toward the housing while providing
electrical insulation and a dimensionally controlled mounting interface.
Electrical Insulation
Volume resistivity of 1014 Ω·cm supports electrical separation
between the circuit board and conductive housing.
Mechanical Interface
Thin alumina plates can be produced with custom holes, slots and irregular
geometries to match the pump assembly.
Technical Specifications
| Material | Alumina Ceramic |
|---|---|
| Alumina Content | >96% |
| Bulk Density | ≥3.65 g/cm³ |
| Thermal Conductivity | ≥25 W/m·K |
| Volume Resistivity | 1014 Ω·cm |
| Dimensional Control Accuracy | ±0.5% |
| Flatness Control Accuracy | ±0.3% |
| Processable Thickness | 0.1–1.0 mm |
| Geometry | Custom irregular shapes, holes and complex slots |
| Main Application | EV / NEV electronic water pump PCB and housing interface |
Final geometry, thickness and dimensional requirements should be reviewed against
the customer’s drawing and assembly conditions.
Why Alumina for This Heat Dissipation and Insulation Plate?
This product is a rigid alumina ceramic plate, not a soft thermal
interface pad. The material combines thermal conductivity with very high electrical
resistivity in a thin structural component.
The ceramic heat dissipation plate is designed as a thin, rigid
alumina component for applications where heat transfer and electrical insulation
are required at the same interface.
Thermal + Electrical Function
The same ceramic component can participate in the thermal path while maintaining
electrical isolation between the PCB and aluminum housing.
Thin Ceramic Geometry
The verified processable thickness range is 0.1–1.0 mm, supporting compact
electronic water pump assemblies.
Custom Shape Capability
Circular, semi-circular, rectangular and irregular shapes with holes and slots
can be reviewed according to the customer drawing.
Controlled Flatness
Flatness and dimensional control are especially relevant where the plate forms
an interface between the PCB and housing.
Heat Transfer and Electrical Isolation in the Pump Assembly
Actual thermal performance depends on more than the ceramic material alone.
Contact surfaces, flatness, thickness, mounting pressure and surrounding materials
can all influence the final heat-transfer path.
PCB Contact Area
Housing Contact Surface
Target Plate Thickness
Flatness Requirement
Hole and Slot Geometry
Assembly Pressure
For this reason, Zhengqiang recommends reviewing the ceramic plate together with
the pump housing and PCB interface instead of selecting the part only from a generic
material specification.
Custom Shapes from Customer Drawings
Zhengqiang supports drawing-based ODM development of thin alumina ceramic plates
for EV and electronic water pump applications.
Custom Profile
Circular, rectangular and irregular plate geometries can be evaluated
according to the pump layout.
Holes & Slots
Complex openings, mounting holes and slots can be reviewed based on functional
and manufacturing requirements.
Drawing Review
Critical dimensions, thickness, flatness and interface conditions should
be identified before prototype evaluation.
What Should You Provide for an ODM Review?
2D Drawing or 3D Model
Target Plate Thickness
Critical Dimensions
Required Flatness
PCB and Housing Interface
Hole / Slot Requirements
Operating Environment
Estimated Annual Quantity
Providing these details helps determine whether the geometry and dimensional
requirements are suitable for prototype development and stable production.
For each custom ceramic heat dissipation plate, thickness,
flatness, hole geometry and mating surfaces should be reviewed against the
actual EV water pump design.
Related Ceramic Components for Water Pump Applications
A ceramic heat dissipation plate addresses the electronic and thermal interface
of the pump. Other ceramic components may serve different functions such as
rotating wear interfaces or structural parts.
Frequently Asked Questions
Where is the ceramic plate installed in an EV water pump?
The current product is designed for installation between the aluminum pump
housing and the PCB or circuit board.
Is this heat dissipation plate made from alumina or zirconia?
The verified product specification identifies the material as alumina ceramic
with an alumina content above 96%.
What is the thermal conductivity of this alumina ceramic plate?
The current verified product specification lists thermal conductivity of
≥25 W/m·K.
What thickness range is currently available?
The verified processable thickness range shown for this product is 0.1–1.0 mm.
Final geometry should still be reviewed against the customer drawing.
Can irregular holes and slots be produced?
Custom irregular geometries and complex holes or slots are supported subject
to engineering and manufacturability review.
What information should I send for an ODM drawing review?
Send the drawing or 3D model, target thickness, critical dimensions, flatness
requirement, PCB and housing interface information, operating conditions
and expected quantity.
Need a Custom Alumina Plate for an EV Water Pump?
Send your plate drawing, target thickness, installation interface and operating
requirements for an ODM manufacturability review.
